Gigabyte er klar med fire B75 baserede Intel bundkort

Gigabyte er klar med fire B75 baserede Intel bundkort

Gigabyte er officielt kommet med fire nye B75 baserede bundkort, til Intels LGA 1155 processorer. Bundkortene understøtter de nuværende Sandy Bridge processorer, samt de kommende 22 nm 3. generations Ivy Bridge processorer.

 

De fire nye bundkort er GA-P75-D3GA-B75-D3VGA-B75M-D3H og GA-B75M-D3V.

 

Her har vi taget specifikationerne på Gigabyte GA-B75-D3V, mens der er billeder af alle fire bundkort nederst.

 

 

CPU
  1. Support for Intel® Core™ i7 processors/Intel® Core™ i5 processors/ Intel® Core™ i3 processors/Intel® Pentium® processors/Intel® Celeron® processors in the LGA1155 package
  2. L3 cache varies with CPU
(Some Intel® Core™ processors require a graphic card, please refer "CPU support List" for more information.)
Chipset
  1. Intel® B75 Express Chipset
Memory
  1. 4 x 1.5V DDR3 DIMM sockets supporting up to 32 GB of system memory
    * Due to Windows 32-bit operating system limitation, when more than 4 GB of physical memory is installed, the actual memory size displayed will be less than 4 GB.
  2. Dual channel memory architecture
  3. Support for DDR3 1600/1333/1066 MHz memory modules
    * To support DDR3 1600 MHz, you must install an Intel 22nm CPU.
  4. Support for non-ECC memory modules
  5. Support for Extreme Memory Profile (XMP) memory modules
    * To support XMP memory, you must install an Intel 22nm CPU.
(Please refer "Memory Support List" for more information.)
Onboard Graphics Integrated Graphics Processor:
  1. 1 x D-Sub port
  2. 1 x DVI-D port, supporting a maximum resolution of 1920x1200
    * The DVI-D port does not support D-Sub connection by adapter.
Audio
  1. Realtek ALC887 codec
  2. High Definition Audio
  3. 2/4/5.1/7.1-channel
    * To configure 7.1-channel audio, you have to use an HD front panel audio module and enable the multi-channel audio feature through the audio driver.
  4. Support for S/PDIF Out
LAN
  1. Atheros GbE LAN chip (10/100/1000 Mbit)
Expansion Slots
  1. 1 x PCI Express x16 slot, running at x16 (PCIEX16)
    (The PCIEX16 slot conforms to PCI Express 3.0 standard.)
    * For optimum performance, if only one PCI Express graphics card is to be installed, be sure to install it in the PCIEX16 slot.
    * The PCI Express x16 slot supports up to PCI Express 2.0 standard when an Intel 32nm (Sandy Bridge) CPU is installed.
  2. 1 x PCI Express x16 slot, running at x4 (PCIEX4)
  3. 3 x PCI Express x1 slots
    (The PCIEX4 slot and all PCI Express x1 slots conform to PCI Express 2.0 standard.)
  4. 2 x PCI slots
Multi-Graphics Technology
  1. Support for AMD CrossFireX™ technology
    * The PCIEX16 slot operates at up to x4 mode when AMD CrossFireX™ is enabled.
Storage Interface Chipset:
  1. 1 x SATA 6Gb/s connector (SATA3 0) supporting up to 1 SATA 6Gb/s device
  2. 4 x SATA 3Gb/s connectors (SATA2 1~4) supporting up to 4 SATA 3Gb/s devices
  3. 1 x mSATA connector
USB Chipset:
  1. Up to 4 USB 3.0/2.0 ports (2 ports on the back panel, 2 ports available through the internal USB headers)
    * In Windows XP, the Intel USB 3.0 ports can support up to USB 2.0 transfer speed.
  2. Up to 8 USB 2.0/1.1 ports (4 ports on the back panel, 4 ports available through the internal USB headers)

 

 

Gigabyte er klar med fire B75 baserede Intel bundkort

 

 

Gigabyte er klar med fire B75 baserede Intel bundkort

 

 

Gigabyte er klar med fire B75 baserede Intel bundkort

 

 

Gigabyte er klar med fire B75 baserede Intel bundkort


Link: Gigabyte

Skrevet af Martin den 12. Apr 2012. Nyheden er læst 1133 gang(e).

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