AMD og IBM udvikler ny type transistor teknologi

AMD og IBM udvikler ny type transistor teknologi

Op til 24 procents forøgelse i hastighed i forhold til nuværende transistorer uden teknologien er hvad AMD lover.

AMD, IBM Announce Semiconductor Manufacturing Technology Breakthrough - Industry-First Advancement Can Improve Performance, Conserve Power in Future Single- and Multi-Core Processors

SUNNYVALE, CA and EAST FISHKILL, NY-December 13, 2004-AMD and IBM today announced that they have developed a new and unique strained silicon transistor technology aimed at improving processor performance and power efficiency. The breakthrough process results in up to a 24 percent transistor speed increase, at the same power levels, compared to similar transistors produced without the technology.

Faster, more power-efficient transistors are the building blocks of higher performance, lower power processors. As transistors get smaller, they operate faster, but also risk operating at higher power and heat levels due to electrical leakage or inefficient switching. AMD and IBM's jointly developed strained silicon helps overcome these challenges. In addition, this process makes AMD and IBM the first companies to introduce strained silicon that works with silicon-on-insulator (SOI) technology, resulting in an additive performance and power savings benefit.

"Innovative process technologies such as strained silicon enable AMD to deliver more value to our customers," said Dirk Meyer, executive vice president, Computation Products Group, AMD.  "Our shared progress in developing advanced silicon technologies allows AMD to deliver today's best performance per watt, and this strained silicon development is expected to extend that leadership when we begin shipping the dual-core AMD Opteron(tm) processor in mid-2005."

AMD intends to gradually integrate the new strained silicon technology into all of its 90nm processor platforms, including its future multi-core AMD64 processors. AMD plans to ship the first 90nm AMD64 processors using the technology in the first half of 2005.

IBM plans to introduce the technology on multiple 90nm processor platforms, including its Power Architecture-based chips, with the first products slated to begin shipping in the first half of 2005.

"Innovation has surpassed scaling as the primary driver of semiconductor technology performance improvements," said Lisa Su, vice president of technology development and alliances, IBM Systems & Technology Group.  "This achievement with AMD demonstrates that companies willing to share their expertise and skills can find new ways to overcome roadblocks and help lead the industry to the next generation of technology advancements."

The new strained silicon process, called "Dual Stress Liner," enhances the performance of both types of semiconductor transistors, called n-channel and p-channel transistors, by stretching silicon atoms in one transistor and compressing them in the other.  The dual stress liner technique works without the introduction of challenging, costly new production techniques, allowing for its rapid integration into volume manufacturing using standard tools and materials.

AMD and IBM researchers are the first in the industry to simultaneously enhance the performance of both types of transistors in a semiconductor using conventional materials.

"This breakthrough in strained silicon engineering is a result of our joint development alliance and the efforts of our partnered teams at IBM's facility in New York and AMD's facility in Germany," said Nick Kepler, vice president of logic technology development, AMD.  "This is a better way to deliver the performance enhancements and power reduction that AMD Opteron(tm) and AMD Athlon(tm) 64 processor customers expect."

Details of the AMD-IBM Dual Stress Liner innovation will be disclosed at the 2004 IEEE International Electron Devices Meeting in San Francisco, Calif. from December 13-15, 2004.  The Dual Stress Liner with SOI technology was developed by engineers from IBM, AMD, Sony and Toshiba at IBM's Semiconductor Research and Development Center (SRDC) in East Fishkill, NY, as well as engineers from AMD at its Fab 30 facility in Dresden, Germany.

IBM and AMD have been collaborating on the development of next-generation semiconductor manufacturing technologies since January 2003. 

Link:

Skrevet af Lasse den 13. Dec 2004. Nyheden er læst 1336 gang(e).

Del med dine venner

     

0 kommentarer
Skriv kommentar til nyheden Kommentarer til nyheden fra Facebook

 

Apacer Panther DDR4 3000MHz Gaming

Apacer er en gammel hund, når det kommer til udviklingen af hukommelse. De har været med i spillet siden 1997,

Læs Mere

Turtle Beach Impact 700

Vi skal i dag se på et mekanisk keyboard fra Turtle Beach, IMPACT 700. Det er et keyboard der gør brug af Che

Læs Mere

Razer Mano'War 7.1

Razer er tilbage med et redesign af deres Razer ManO'War 7.1 Gaming Headset – Denne gang en lidt neddroslet udg

Læs Mere

SilverStone RL06 ATX

SilverStone kan andet end at lave lækre strømforsyninger og premium computer kabinetter. Med deres Redline se

Læs Mere

Gigabyte AB350-Gaming 3

En ny uge står for døren, og efter en weekend med sne i visse dele af Danmark, så trænger vi til

Læs Mere

TomTom Touch fitness-tracker

TomTom Touch er en fitness-tracker, der søger at kunne tilbyde lidt mere end bare den basale skridt- og kaloriet&ae

Læs Mere

Sculpto 3D Printer

3D print er et segment i rivende udvikling, og i dag benytter man 3D print inden for mange områder. Blandt andet er

Læs Mere

AOC AGON AG352UCG 2K WQHD

Er du til gamerskærme med kurver er dagens test måske lige noget for dig – Vi tager nemlig i dag et kig

Læs Mere

 

Nyeste Videoer og Trailers

Seneste nyheder

MSI melder sin ankomst med GeForce GTX 1080 Ti GAMING X

Nu vil MSI også lege med i 1080 Ti kampen, og derfor skyder de nu kampen igang med deres nye MSI GTX 1080 Ti G
Læs Mere

GIGABYTE releaser Z270X-DESIGNARE

Med release af GIGABYTE Z270X-DESIGNARE, bliver vi præsenteret ikke alene for et super visuelt veludført bundk
Læs Mere

Samsung giver ikke op på buede TV

Ifølge en rapport fra ET News planlægger Samsung at udgive 22 buede fjernsyn til deres globale marked. Dette k
Læs Mere

Hackere truer stadig Apple

Som du måske har hørt, har en gruppe af hackere for nyligt været ude og true Apple. De ville have Apple til at
Læs Mere

Teenager sagsøger mor for at tage hans telefon

I Spanien er en 15-årige så frustreret over, at hans mor har taget hans telefon. Nu vil han lægge sag an mod h
Læs Mere

North deltager i Intel Extreme Master i Sydney.

North er det sidste hold, som er blevet inviteret til IEM i Sydney 2017. Her vil de komme til, at konkurrere m
Læs Mere

BIOS opdatering skal løse FMA3 problemer på AMD Ryzen 7

I følge rygtebørsen, så vil AMD Ryzen gennem BIOS opdateringer få løst problemer med FMA3 instruktioner.
Læs Mere

Glæd Jer til det nye MSI X370 KRAIT GAMING

Er projekt gaming PC næste mål, så burde du måske vende blikket i retning af MSI og deres nye X370 KRAIT GAMIN
Læs Mere
Indsend nyhed
Har du fundet en fed nyhed så indsend den så alle andre på Tweak.dk kan få glæde af den.