AMD fremviser deres 2014 roadmap for next-gen. processorer til server og segmentet for såkaldt embedded computing, og for første gang ser vi ARM processorer på dette roadmap.
I forhold til konkurrenten, Intel, og deres x86 chips og discrete grafikløsninger for selvsamme segment, så planlægger AMD lancering af de ARM baseret chips i 2014.
AMD’s første udspil på ARM processorerne bliver en chip med kodenavn Hierofalcon, som er 64bit chips med op til 8 ARM Cortex-A57 processor cores, og en and clock hastighed på 2GHz.
Disse chips, er designet til server segmentet samt føromtalte embedded enheder frem for tablets, laptops eller smartphones, dog udtaler AMD, at det ikke bliver udelukket, at disse chips bliver integreret i forbrugerelektronik i fremtiden.
De nye Hierofalcon chips supporterer blandt andet 2x 64bits DDR3/4, 10GB Ethernet, samt PCI Express
Planlagte release dato, er sat til Q2 2014, og en masseproduktion sker fra Q3 og frem.
Her er den komplette oversigt:
“Hierofalcon” CPU SoC — the first 64-bit ARM-based platform from AMD targeting embedded data center applications, communications infrastructure, and industrial solutions. It will include up to eight ARM Cortex-A57 CPUs expected to run up to 2.0GHz and provides high performance memory with two 64-bit DDR3/4 channels with error correction code (ECC) for high reliability applications. The highly-integrated SoC includes 10Gb KR Ethernet and PCI-Express Gen 3 for high-speed network connectivity, making it ideal for control plane applications. The “Hierofalcon” series also provides enhanced security with support for ARM TrustZone technology and a dedicated cryptographic security co-processor, aligning to the increased need for networked, secure systems. “Hierofalcon” is expected to be sampling in the second quarter of 2014 with production in the second half of the year.
“Bald Eagle” APU/CPU — The next generation high-performance x86-based embedded processor available as both an APU and CPU featuring up to four new “Steamroller” CPU cores within a 35W TDP. The APU products will provide the new power optimized AMD Radeon Graphics Core Next GPU architecture, and HSA enhancements for high-performance embedded applications, making it a superior solution for next generation digital signage and embedded digital gaming. The “Bald Eagle” family will also introduce new power management features, such as configurable TDP, allowing engineers more design flexibility. ”Bald Eagle” is expected to be available in the first half of 2014.
“Steppe Eagle” APU SOC — Further extends the performance and low-power range of the current AMD Embedded G-Series APU SOC platform with an enhanced “Jaguar” CPU core architecture and AMD Graphics Core Next GPU architecture that include new features for increased CPU and GPU frequency. Designed for low-power embedded applications, “Steppe Eagle” is designed to offer increased performance-per-watt both at a lower TDP than the current AMD Embedded G-Series APU SOC, as well as extending the high-end performance above 2GHz. “Steppe Eagle” also provides embedded design engineers the flexibility to leverage the current AMD Embedded G-Series APU SOC board design and software stack for a variety of applications with footprint compatibility. “Steppe Eagle” is expected to be available in the first half of 2014.
“Adelaar” discrete GPU — The next-generation discrete AMD Embedded Radeon GPU based on Graphics Core Next architecture specifically designed for embedded applications. “Adelaar” comes as a multi-chip-module (MCM) with pre-qualified and integrated 2GB of graphics memory. The “Adelaar” GPU family will deliver rich 3D graphics, multi-display support and support for DirectX 11.1, OpenGL 4.2 and both Windows and Linux. “Adelaar” is expected to be available in the first half of 2014 with seven years of planned supply availability as an MCM, mobile PCI express module (MXM) and standard PC graphics card2.
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