There is no doubt about it, producing bleeding edge silicon is going through a lot of pain at this years' Mobile World Congress. TSMC's even openly admitted that the yields for its state-of-the-art 28nm process are far from satisfactory - the situation is still better than it was for the 40nm process.
Intel is having issues with the 22nm FinFET (so called 3D transistors), while GlobalFoundries had issues in ramping up both 32nm and 28nm process. Samsung is being silent but we've all seen the amount of 3rd party chips the company ordered from NVIDIA and TI to compensate for its own products.
Yet, the development of the latest products is not stopping. According to the rumors in Barcelona, NVIDIA went by the book and taped out T40, i.e. Wayne in late December 2011. The silicon took some time to get back and the company is now starting to sample its OEM partners with the next generation parts which will be launched at the next years' CES and MWC. You can probably expect a repeat of the Tegra 3 launch - limited run of units through a single vendor (in case of Tegra 3, it was ASUS and Transformer Prime tablet), and mass availability in the second quarter of 2013.
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