MSI er i dag kommet med deres første bundkort, til de sprit nye 32 nm Core i3 og Core i5 processorer fra Intel. Der er tale om fire H55 baserede og et H57 baseret bundkort, der alle har D-Sub, DVI og HDMI udgange.
Bundkortene baseret på H55 chipsettet er MSI H55M-P31, H55M-E33, H55M-ED55 og H55-GD65 mens det første MSI bundkort baseret på H57 chipsettet er H57M-ED65.
MSI officially releases H57/H55 Intel chipset products today. These mainboards offer outstanding 3D performance, effective heat dissipation and remarkable power efficiency and stability. MSI's exclusive one-second overclocking technology OC Genie improves performance of the 32nm Intel Core i5 and Core i3 processors with integrated graphics cores. It can enhance 3D performance by up to 45%, allowing smooth high definition video playback and seizing the advantage while playing games!
MSI H57/H55 Series mainboards are equipped with improved OC Genie auto overclocking technology. By just one press of the OC Genie button the mainboard will automatically overclock both the CPU and GPU. Improved memory module and chipset values give an overall 3D performance boost of up to 45%. This allows superior performance when watching high bit-rate HD videos or when playing online games!
In addition to the outstanding performance, MSI's H57/H55 Series mainboards support Intel 32nm Clarkdale Core i3/i5 processors with integrated graphics processors called Intel HD Graphics. The IGP is compatible with mainstream 3D graphic standards like DirectX 10, Shader Model 4.0 and OpenGL 2.0 to provide stunning 3D performance. With ClearVideo HD technology video playback is optimized for the best performance and the highest image quality. Lossless Audio support and HDMI/Display Port/DVI/D-sub output capability allow consumers to experience high quality visuals and booming audio of full HD Blu-ray video!
MSI H55 and H57 mainboards are equipped with DrMOS power supply modules. Its 3-in-1 chipset design provides four times the response time of traditional power supply designs. In addition, it features a power utilization efficiency of over 90%. Additionally, MSI has incorporated its high-end SuperPipe design resulting in the most efficient, full copper 8mm main heat conduit, which has a 60% larger diameter than standard heat conduits. It provides the most effective thermal design for critical components on the mainboards.
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