- Overview -
The burn-in process is frequently conducted in electronic components as a form of reliability engineering. It is a process that stresses the components at elevated temperature and elevated voltage. The intention is to detect the early
failure components to improve the overall product quality and user satisfaction.
In DRAM industry, the burn-in process has only been used in the most demanding and expensive Server Dimm or military specification memory.
- The DBT Difference -
However, the GeIL Die-hard Burn-in Technology changes all that. The DBT process is conducted in GeILs’ own designed burn-in chamber – DBT-1. Inside it, 1000 pieces of modules are slotted onto the own-designed module-interface and DRAM controller boards. The modules are then dynamically tested by own-designed testing software simultaneously. DBT-1 is able to elevate testing temperature up to 100 degrees Celsius with burn-in time of as long as 24 hours. GeIL Die-hard Burn-in Technology is an ingenious tool in memory manufacturing with great flexibility in testing functionalities. It eliminates early-failure memory and ultimately provides users with the highest quality memory products.
Del med dine venner