Intel gør processorerne blyfri

Intel gør processorerne blyfri

Alle Intels processorer bliver blyfri. Virksomhedens 45nm Hi-k Intel®-processorer, der kommer i produktion i anden halvdel af 2007, vil blive udviklet med en helt ny blyfri teknik hvor en legering bestående af tin, sølv og kobber erstatter tungmetaller. Blandt de nye 45nm-processorer indgår næste generation Intel® Core™ 2 Duo, Core 2 Quad och Xeon®-processorer. Næste år bliver 65-nanometer chipsettene ligeledes 100% blyfri.

Intel har i lang tid brugt store ressourcer på at udviklingen af miljørigtige teknikker, og virksomheden producerede allerede i 2002 sin første blyfri flash memory. I 2004 lancerede Intel en teknik, der reducerede processorernes blyindhold med 95 % og nu har de udviklet en teknik, der eliminerer de resterende 5 %. En anden vigtig miljørigtig egenskab med de kommende 45nm Hi-k Intel®-processorerer er, at den ny fremstillingsmetode medfører en kraftig reduktion i processorernes energiforbrug.

Yderligere information om Intels arbejde for et bedre miljø kan findes her.


Intel Corporation today announced that its future processors, beginning with its entire family of 45 nanometer (nm) high-k metal gate (Hi-k) processors, are going 100 percent lead-free. The Intel 45nm Hi-k family includes the next-generation Intel® Core™ 2 Duo, Core 2 Quad and Xeon® processors, and the company will begin 45nm Hi-k production in the second half of this year.

“Intel is taking an aggressive stance toward environmental sustainability, from the elimination of lead and a focus on greater energy efficiency of our products to fewer air emissions and more water and materials recycling,” said Nasser Grayeli, Intel vice president and director of assembly test technology development, Technology and Manufacturing Group.

Lead is used in a variety of micro-electronic “packages” and the “bumps” that attach an Intel chip to the packages. Packages wrap around the chip and ultimately connect it to the motherboard. Different types of packages are used for processors targeted at specific market segments, including mobile, desktop and server. Package designs include pin grid array, ball grid array and land grid array, and all are 100 percent lead-free in Intel’s 45nm Hi-k technology generation. In 2008, the company will also transition its 65nm chipset products to 100 percent lead-free technology.

Intel’s 45nm processors not only are lead-free, they also make use of the company’s Hi-k silicon technology for reduced transistor leakage, enabling more energy-efficient, high-performance processors. The company’s 45nm Hi-k silicon technology also includes third-generation strained silicon for improved drive current and a lower interconnect capacitance using low-k dielectrics for increased performance and lower power. Ultimately, Intel’s 45nm Hi-k family of processors will enable sleeker, smaller and more energy-efficient desktop, notebook PC, mobile internet device and server designs.

For many decades lead has been used in electronics because of its electrical and mechanical properties, making the search for replacement materials that meet performance and reliability requirements a significant scientific and technical challenge.

Due to lead’s potential impact to the environment and public health, Intel has worked for years with its suppliers and other companies in the semiconductor and electronics industry to develop lead-free solutions as part of its long-standing commitment to environmental practices. In 2002, Intel produced its first lead-free flash memory products. In 2004, the company began shipping products with 95 percent less lead than previous microprocessor and chipset packages.

To replace the remaining 5 percent (about .02 grams) of lead solder historically found in the first-level interconnect -- the solder joint that connects the silicon die to the package substrate -- in processor packages, Intel will use a tin/silver/copper alloy. It is the way in which Intel will implement these new materials to replace the tin/lead solder that is the “secret sauce” of the company’s solution. Because of the complex interconnect structure of Intel’s advanced silicon technologies, a great deal of engineering work was required to remove the remaining lead in Intel’s processor packages and integrate a new solder alloy system.

Intel engineers developed the assembly manufacturing processes involving the new solder alloys, and were able to accomplish this while still demonstrating the high level of performance, quality and reliability expected of Intel components.

Link:

Skrevet af Martin den 22. May 2007. Nyheden er læst 1355 gang(e).

Del med dine venner

     

0 kommentarer
Skriv kommentar til nyheden Kommentarer til nyheden fra Facebook

 

Western Digital My Passport Wireless SSD 500 GB

Hvis du er en aktiv udendørs fotograf, der gerne vil have 100 procent styr på sine billeder på farten,

Læs Mere

OnePlus 6 - Glas og notch er det nye spejlblanke sorte hos OnePlus

OnePlus vokser i popularitet, og deres seneste OnePlus 6 er selvfølgelig lanceret med et håb om at fange inte

Læs Mere

MSI Immerse GH70 Headset

MSI som mest er kendt for deres bund og grafikkort, har sendt os et af deres nye og lidt anderledes produkter. Vi har modt

Læs Mere

Cooler Master MasterWatt 550 Watt

Cooler Master udvider deres MasterWatt serie af strømforsyninger med modeller, som spænder fra 450-750 watt.

Læs Mere

Cooler Master RGB Hard Gaming Mouse Pad

Der var en gang hvor en musemåtte blot var en kedelig stof eller plastik ting, man havde liggende på sit skriv

Læs Mere

FitBit Charge 2 fitness tracker

Vi byder i dag på en test til de mere fitnessinteresserede brugere på vores side. Sig pænt goddag t

Læs Mere

Arozzi Mezzo V2 - Gaming Stol

Mange og lange timer foran computeren, kræver selvfølgeligt et godt sted at slå ballerne ned. Med

Læs Mere

Razer Panthera Arcade stick

Vi har igen Razer på besøg, i dag i en lidt mere extraordinær udgave, med deres Street Fighter special

Læs Mere

 

Nyeste Videoer og Trailers

Seneste nyheder

Tweak News - Uge 21 - GIVEAWAY

Lige om lidt tager Kenneth til Taiwan for at dække Computex 2018. Inden vi når så langt i programmet, når vi l
Læs Mere

Rochi Shion deler synopsis for Avengers 4

Hvad skulle vi dog gøre uden de sociale medier? Rochi Shion har via Twitter formået at give Marvel-fansene en
Læs Mere

Essential er sat til salg

Essential er et forholdsvis nyt foretagende fra Andy Rubin. Man er dog allerede nu ved at smide håndklædet i r
Læs Mere

EA har frigivet de foreløbige minimums systemkrav til Battlefield V

I første omgang handler det om minimumskravene til PC til det kommende Battlefield V, og hvad det tyder på, så
Læs Mere

MSI PRO 24X Series Ultra Slim All-in-One Desktop PC annonceret

MSI har i indeværende uge annonceret en ny all in one PC. MSI PRO 24X Series Ultra Slim All-in-One Desktop PC,
Læs Mere

Far Cry 5 Hours of Darkness, Vietnam DLC frigives 5 juni

Det super populære Far Cry 5 ikldes en ny DLC 5 juni 2018. Med navnet Hours of Darkness, Vietnam DLC, er der l
Læs Mere

Huawei finder display-partner til ny foldelig smartphone

BOE har fået æren af at fremstille det display, der skal påføres den nye foldelige smartphone fra Huawei.
Læs Mere

Apple indgår samarbejdsaftale med Volkswagen

Selvkørende biler er et af de nyere projekter, som Apple har kastet sig over. Nu er også Volkswagen blevet en
Læs Mere
Partner sider
Indsend nyhed
Har du fundet en fed nyhed så indsend den så alle andre på Tweak.dk kan få glæde af den.