Sunnyvale, CA—November 8, 2006—OCZ Technology Group,a worldwide leader in innovative ultra high performance and highreliability memory, today unveiled the new and improved OCZ NVIDIA®SLI™-Ready branded memory product family. The new PC2-7200 SLI-Readyand PC2-8500 SLI-Ready modules now feature the first ever exclusivelydesigned heatspreader for NVIDIA.
OCZ worked closely togetherwith NVIDIA to optimize these modules specifically for current and nextgeneration NVIDIA based platforms. As part of the NVIDIA SLI technologyecosystem, these modules undergo a rigorous series of tests by NVIDIAand are certified to provide performance-minded enthusiasts and gamersthe quality, compatibility, and stability they seek when building anSLI gaming system.
“OCZ and NVIDIA have been working closelytogether to deliver the ultimate experience to high-end consumers withthe new SLI-Ready series of modules,” commented Dr. Michael Schuette,VP of Technology Development, OCZ Technology Group. “Through ourcooperation, we are able to deliver a customized solution for NVIDIAgamers, enthusiasts, and SI’s, one that addresses both the EPP memoryperformance and cooling requirements with a solution that is tailormade specifically for these customers.”
For more information on the new OCZ SLI-Ready DDR2 series, please visit our product page here.
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